HBM tracker / memory register

Methodology

A source for each value, a defined stack identity, and a dated public milestone. Research checked 2026-11-11.

What makes one record

One row identifies a maker, generation, capacity and DRAM stack configuration. A published speed bin is a separate variant when the maker explicitly lists it. SK hynix’s historical Hot Chips lineup names each capacity and speed combination; those rows are labelled historical catalog entries. These descriptive identities do not imply an orderable manufacturer part number.

Repeated announcements of the same stack are merged into one record. Planned extensions remain separate from sampled stacks, and a packaging prototype is labelled as a demonstration. The three established suppliers are covered. Records need at least three supported specification or milestone fields beyond name, URL and summary.

How rates are compared

Capacity and bandwidth describe one stack. Layer counts exclude the base die. GB and Gb retain the vendors’ notation; bandwidth in TB/s is converted to GB/s with a decimal factor of 1,000. “Up to”, “over”, “at least” and family ranges remain visible in the table, detail and compare views. Sorting uses the published numeric endpoint; it does not rank guaranteed application throughput.

Family ratings are explicitly identified in the reading notes. Capacity/height options are paired only where the published lineup supports them. Speeds are not assigned to planned extensions or higher stacks solely because a related part has that speed. Bandwidth is left null when the source only publishes a pin rate.

When vendor specifications change

Current portfolio specifications take priority for catalog ratings; dated releases establish milestones. Samsung’s HBM3E catalog currently lists up to 9.2 Gb/s and 1,180 GB/s, while earlier development publicity gives higher ceilings. SK hynix’s current HBM3E portfolio likewise differs from its original launch rating. The affected records explain these differences and retain the relevant evidence.

How to read status dates

A status date identifies the publication supporting that milestone. Year-only or month-only evidence keeps that precision. A planned ramp is not promoted to production when the target date passes. A production report does not prove present inventory or continued manufacture. Current undated catalog entries have no invented launch date and are omitted from the timeline.

“Production reported” requires an explicit statement of production or shipments. “Family production reported” means the maker confirms shipments of the generation without disclosing a capacity split; it does not establish variant-level shipment dates. “Sampling” requires customer samples. “Demonstrated” covers exhibited hardware or a developed prototype. “Planned” covers a named future configuration. “Catalogued” means a published portfolio entry. “Historical catalog” preserves a past lineup without asserting present availability.

How accelerator links are confirmed

The maker or platform vendor must connect the memory maker and stack variant to a named platform. Shipping, design-in, availability and exhibit relationships are labelled as such. A GPU specifying HBM3E does not establish which vendor supplied it. Supplier assignments, exclusivity and qualification dates remain empty without explicit public evidence.

Scope left out

CXMT and JHICC HBM reports lack enough publicly verified part specifications for comparable rows. Samsung HBM-PIM is a processing-in-memory architecture outside this conventional stack catalog. Micron HBM4E has a development roadmap but no sufficiently specified public stack variant in the reviewed material. No universal JEDEC ceiling is copied onto an unannounced vendor part.

Corrections and funding

Send corrections with a public source to hello@hbmtracker.com. Changed facts update the verification date. Sponsorship is labelled and never changes specifications, inclusion or sorting. The dataset is published by Beundra AB and is available as CSV and JSON under CC BY 4.0. Source material remains the property of its publishers.

Field dictionary

Maker
Memory manufacturer.
Generation
Maker’s HBM generation designation.
DRAM layers (high)
DRAM dies in the stack; excludes the base die.
Stack capacity (GB)
Capacity of one stack, in the maker’s GB units; not accelerator total memory.
Pin rate (Gb/s)
Published pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
Pin qualifier
“Up to”, “Over” and range lower bounds preserve the source’s qualification.
Stack bandwidth (GB/s)
Published bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
Bandwidth qualifier
The source’s bound or range, preserved alongside the numeric value.
Interface (bits)
Data I/O width of one stack; not the complete accelerator bus.
Base die
Published base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
DRAM process
Vendor’s process label, not a normalized physical dimension.
Bonding / package
Published stacking or package process.
Evidence status
Last supported milestone; historical production does not imply current orderability.
Status evidence date
Date of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
Sample evidence date
Publication confirming samples, preserving date precision; not an inferred qualification date.
Production evidence date
Publication confirming production or shipments. A report date, not an exact factory ramp date.
Confirmed platform links
Platforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Reading notes
Variant-specific context, source conflicts, historical status and unconfirmed details.

First-party source register

Vendor product pages, technical presentations, company releases and investor material. Company newsroom releases are first-party press; there are no third-party press values in the published catalog.