Samsung HBM3 24GB

Samsung’s 12-high HBM3 capacity option for accelerator integration.

Production reported · evidence dated 2023-10-21 · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM3

Stack specifications

MakerMemory manufacturer.
Samsung1
GenerationMaker’s HBM generation designation.
HBM31
DRAM layers highDRAM dies in the stack; excludes the base die.
121
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
241
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
Up to 6.41
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
Up to 8191
Interface bitsData I/O width of one stack; not the complete accelerator bus.
1,0241
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Not published
DRAM processVendor’s process label, not a normalized physical dimension.
Not published
Bonding / packagePublished stacking or package process.
Not published
Evidence statusLast supported milestone; historical production does not imply current orderability.
Production reported2
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
2023-10-212
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
Not published
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
2023-10-212
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Not published
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
Samsung’s 2023 Memory Tech Day release confirms both 8H and 12H production. No named accelerator or qualified customer is assigned.1

Source record

  1. Samsung: Samsung HBM3 24GB accessed 2026-11-11
  2. Samsung: HBM3 8H and 12H mass production accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Samsung HBM on HBM Suppliers. Read the method or send a correction.

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