SK hynix HBM3 24GB

The twelve-layer HBM3 stack adds capacity while retaining the predecessor’s package height.

Sampling · evidence dated 2023-04-20 · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM3

Stack specifications

MakerMemory manufacturer.
SK hynix1
GenerationMaker’s HBM generation designation.
HBM31
DRAM layers highDRAM dies in the stack; excludes the base die.
122
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
242
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
Up to 6.42
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
Up to 8192
Interface bitsData I/O width of one stack; not the complete accelerator bus.
Not published
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Not published
DRAM processVendor’s process label, not a normalized physical dimension.
Not published
Bonding / packagePublished stacking or package process.
Advanced MR-MUF1
Evidence statusLast supported milestone; historical production does not imply current orderability.
Sampling1
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
2023-04-201
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
2023-04-201
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
Not published
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Not published
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
The 2023 announcement reports samples and plans for supply in the second half; the plan is not converted into a shipment date.1

Source record

  1. SK hynix: SK hynix HBM3 24GB accessed 2026-11-11
  2. SK hynix HBM portfolio accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests SK hynix HBM on HBM Suppliers. Read the method or send a correction.

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