Micron HBM2E 8GB

The 4-high configuration documented in Micron’s HBM2E technical brief.

Catalogued · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM, HBM2 & HBM2E

Stack specifications

MakerMemory manufacturer.
Micron1
GenerationMaker’s HBM generation designation.
HBM2E1
DRAM layers highDRAM dies in the stack; excludes the base die.
41
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
81
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
Up to 3.21
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
Up to 4101
Interface bitsData I/O width of one stack; not the complete accelerator bus.
1,0241
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Not published
DRAM processVendor’s process label, not a normalized physical dimension.
Not published
Bonding / packagePublished stacking or package process.
Not published
Evidence statusLast supported milestone; historical production does not imply current orderability.
Catalogued1
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
Not published
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
Not published
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
Not published
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Not published
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
Technical brief tables 1 and 3 document the capacity, stack height and maximum family rating. The brief alone does not establish a variant-specific shipment date.1

Source record

  1. Micron: Micron HBM2E 8GB accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Micron HBM on HBM Suppliers. Read the method or send a correction.

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