Samsung Flashbolt 16GB

Samsung’s eight-layer HBM2E package uses denser DRAM dies than Aquabolt.

Planned · evidence dated 2020-02-04 · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM, HBM2 & HBM2E

Stack specifications

MakerMemory manufacturer.
Samsung1
GenerationMaker’s HBM generation designation.
HBM2E1
DRAM layers highDRAM dies in the stack; excludes the base die.
81
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
161
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
3.21
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
4101
Interface bitsData I/O width of one stack; not the complete accelerator bus.
Not published
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Buffer chip1
DRAM processVendor’s process label, not a normalized physical dimension.
10nm-class (1y)1
Bonding / packagePublished stacking or package process.
Not published
Evidence statusLast supported milestone; historical production does not imply current orderability.
Planned1
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
2020-02-041
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
Not published
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
Not published
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Not published
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
Market launch announcement; mass production was planned for the first half of 2020. The tested 4.2 Gb/s / 538 GB/s ceiling is not used as the product rating.1

Source record

  1. Samsung: Samsung Flashbolt 16GB accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Samsung HBM on HBM Suppliers. Read the method or send a correction.

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