Micron HBM3E 24GB
Micron’s eight-high HBM3E is linked to NVIDIA H200 and Blackwell platforms.
Production reported · evidence dated 2024-02-26 · verified 2026-11-11
Stack specifications
- MakerMemory manufacturer.
- Micron1
- GenerationMaker’s HBM generation designation.
- HBM3E1
- DRAM layers highDRAM dies in the stack; excludes the base die.
- 81
- Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
- 241
- Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
- Over 9.21
- Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
- Over 1,2001
- Interface bitsData I/O width of one stack; not the complete accelerator bus.
- 1,0241
- Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
- Not published
- DRAM processVendor’s process label, not a normalized physical dimension.
- Not published
- Bonding / packagePublished stacking or package process.
- Not published
- Evidence statusLast supported milestone; historical production does not imply current orderability.
- Production reported3
- Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
- 2024-02-263
- Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
- Not published
- Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
- 2024-02-263
- Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
- NVIDIA H200 (shipping); HGX B200 / GB200 (available)2
- Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
- Vendor lower bounds are preserved. Usable GPU memory can be smaller than the sum of nominal stack capacities.1
Source record
- Micron: Micron HBM3E 24GB accessed 2026-11-11
- Micron: HBM3E platform design-ins accessed 2026-11-11
- Micron HBM3E production evidence accessed 2026-11-11
Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Micron HBM on HBM Suppliers. Read the method or send a correction.