Samsung HBM3E 36GB

MakerMemory manufacturer.

Samsung1

GenerationMaker’s HBM generation designation.

HBM3E1

DRAM layers highDRAM dies in the stack; excludes the base die.

121

Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.

361

Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.

Up to 9.21

Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.

Up to 1,1801

Interface bitsData I/O width of one stack; not the complete accelerator bus.

1,0241

Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.

Not published

DRAM processVendor’s process label, not a normalized physical dimension.

Not published

Bonding / packagePublished stacking or package process.

Not published

Evidence statusLast supported milestone; historical production does not imply current orderability.

Catalogued1

Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.

Not published

Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.

Not published

Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.

Not published

Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.

AMD Instinct MI350X / MI355X (Samsung: primary HBM3E partner)3

Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.

Current portfolio: up to 9.2 Gb/s and 1,180 GB/s. Earlier Shinebolt publicity stated 9.8 Gb/s; the 2024 36GB development release stated 1,280 GB/s. Those announcement ceilings are not substituted for the current catalog rating.2

1. Samsung: Samsung HBM3E 36GB accessed 2026-11-11
2. Samsung 36GB HBM3E development accessed 2026-11-11
3. Samsung and AMD: primary HBM3E partner for MI350X/MI355X accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Samsung HBM on HBM Suppliers. Read the method or send a correction.