Micron HBM3E 36GB

MakerMemory manufacturer.

Micron1

GenerationMaker’s HBM generation designation.

HBM3E1

DRAM layers highDRAM dies in the stack; excludes the base die.

121

Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.

361

Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.

Over 9.21

Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.

Over 1,2001

Interface bitsData I/O width of one stack; not the complete accelerator bus.

1,0241

Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.

Not published

DRAM processVendor’s process label, not a normalized physical dimension.

Not published

Bonding / packagePublished stacking or package process.

Not published

Evidence statusLast supported milestone; historical production does not imply current orderability.

Production reported3

Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.

2025-06-253

Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.

Not published

Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.

2025-06-253

Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.

NVIDIA B300 / GB300 (design-in); AMD Instinct MI355X (design-in)2

Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.

Vendor lower bounds are preserved. Micron first reported 12-high volume production on its 20 March 2025 earnings call; the cited first-party remarks from 25 June 2025 repeat it alongside the MI355X design-in.1

1. Micron: Micron HBM3E 36GB accessed 2026-11-11
2. Micron: HBM3E platform design-ins accessed 2026-11-11
3. Micron HBM3E production evidence accessed 2026-11-11
4. Micron FQ3 2025: MI355X and HBM3E volume ramp accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests Micron HBM on HBM Suppliers. Read the method or send a correction.