SK hynix HBM4 36GB

MakerMemory manufacturer.

SK hynix1

GenerationMaker’s HBM generation designation.

HBM41

DRAM layers highDRAM dies in the stack; excludes the base die.

121

Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.

361

Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.

At least 111

Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.

Over 2,8001

Interface bitsData I/O width of one stack; not the complete accelerator bus.

2,0483

Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.

TSMC logic foundry process; node not stated here2

DRAM processVendor’s process label, not a normalized physical dimension.

Not published

Bonding / packagePublished stacking or package process.

Advanced MR-MUF3

Evidence statusLast supported milestone; historical production does not imply current orderability.

Family production reported6

Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.

2025-10-296

Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.

2025-03-195

Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.

Not published

Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.

NVIDIA Vera Rubin (supplier confirmed)4

Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.

Pin rate and bandwidth are current family portfolio ratings. SK hynix put HBM4 into mass production in Q3 2025 and began mass shipments in Q2 2026. It names the 12-layer 36GB HBM4 as the stack inside NVIDIA Vera Rubin. Production of the 24GB and 48GB stacks is not inferred.7

1. SK hynix: SK hynix HBM4 36GB accessed 2026-11-11
2. SK hynix: base die collaboration with TSMC accessed 2026-11-11
3. SK hynix HBM4: 2K I/O and Advanced MR-MUF accessed 2026-11-11
4. SK hynix: Vera Rubin uses 12-layer 36GB HBM4 accessed 2026-11-11
5. SK hynix HBM4 samples accessed 2026-11-11
6. SK hynix Q3 2025: HBM4 entered mass production accessed 2026-11-11
7. SK hynix Q2 2026: HBM4 mass shipments began accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests SK hynix HBM on HBM Suppliers. Read the method or send a correction.