SK hynix HBM3E 36GB

The twelve-layer HBM3E stack appears in SK hynix’s demonstration of NVIDIA GB300.

Production reported · evidence dated 2024-09-26 · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM3E

Stack specifications

MakerMemory manufacturer.
SK hynix1
GenerationMaker’s HBM generation designation.
HBM3E1
DRAM layers highDRAM dies in the stack; excludes the base die.
121
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
361
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
At least 9.61
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
At least 1,2301
Interface bitsData I/O width of one stack; not the complete accelerator bus.
Not published
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Not published
DRAM processVendor’s process label, not a normalized physical dimension.
Not published
Bonding / packagePublished stacking or package process.
Advanced MR-MUF2
Evidence statusLast supported milestone; historical production does not imply current orderability.
Production reported2
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
2024-09-262
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
Not published
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
2024-09-262
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
NVIDIA GB300 (maker exhibit)3
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
The current family portfolio gives 1.23+ TB/s; the 2024 production announcement gives a 9.6 Gb/s pin rate.1

Source record

  1. SK hynix: SK hynix HBM3E 36GB accessed 2026-11-11
  2. SK hynix HBM3E production announcement accessed 2026-11-11
  3. SK hynix at TSMC Symposium 2026 accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests SK hynix HBM on HBM Suppliers. Read the method or send a correction.

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