SK hynix HBM3E 48GB
A sixteen-layer HBM3E development shown publicly at CES, distinct from the production twelve-layer stack.
Demonstrated · evidence dated 2025-01-10 · verified 2026-11-11
Stack specifications
- MakerMemory manufacturer.
- SK hynix1
- GenerationMaker’s HBM generation designation.
- HBM3E1
- DRAM layers highDRAM dies in the stack; excludes the base die.
- 161
- Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
- 481
- Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
- Not published
- Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
- Not published
- Interface bitsData I/O width of one stack; not the complete accelerator bus.
- Not published
- Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
- Not published
- DRAM processVendor’s process label, not a normalized physical dimension.
- Not published
- Bonding / packagePublished stacking or package process.
- Advanced MR-MUF1
- Evidence statusLast supported milestone; historical production does not imply current orderability.
- Demonstrated2
- Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
- 2025-01-102
- Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
- Not published
- Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
- Not published
- Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
- Not published
- Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
- Commercialization was planned for 2025. The cited CES exhibit confirms a demonstration, not customer shipments.1
Source record
- SK hynix: SK hynix HBM3E 48GB accessed 2026-11-11
- SK hynix CES 2025 exhibit accessed 2026-11-11
Every date is the publication date of the maker’s evidence. See who packages, bonds and tests SK hynix HBM on HBM Suppliers. Read the method or send a correction.