SK hynix HBM3E 48GB

A sixteen-layer HBM3E development shown publicly at CES, distinct from the production twelve-layer stack.

Demonstrated · evidence dated 2025-01-10 · verified 2026-11-11

Read maker evidenceCompare these stacksAll HBM3E

Stack specifications

MakerMemory manufacturer.
SK hynix1
GenerationMaker’s HBM generation designation.
HBM3E1
DRAM layers highDRAM dies in the stack; excludes the base die.
161
Stack capacity GBCapacity of one stack, in the maker’s GB units; not accelerator total memory.
481
Pin rate Gb/sPublished pin rate. Read with Pin qualifier; a limit is not a guaranteed operating point.
Not published
Stack bandwidth GB/sPublished bandwidth of one stack. Read with Bandwidth qualifier. TB/s is normalized to GB/s using 1,000.
Not published
Interface bitsData I/O width of one stack; not the complete accelerator bus.
Not published
Base diePublished base/buffer die implementation or foundry. Null means not disclosed in the cited evidence.
Not published
DRAM processVendor’s process label, not a normalized physical dimension.
Not published
Bonding / packagePublished stacking or package process.
Advanced MR-MUF1
Evidence statusLast supported milestone; historical production does not imply current orderability.
Demonstrated2
Status evidence dateDate of the supporting publication, with original precision (YYYY, YYYY-MM or YYYY-MM-DD). Not necessarily the first shipment day.
2025-01-102
Sample evidence datePublication confirming samples, preserving date precision; not an inferred qualification date.
Not published
Production evidence datePublication confirming production or shipments. A report date, not an exact factory ramp date.
Not published
Confirmed platform linksPlatforms explicitly linked to this maker and variant by a first-party source. Design-in is distinguished from shipping.
Not published
Reading notesVariant-specific context, source conflicts, historical status and unconfirmed details.
Commercialization was planned for 2025. The cited CES exhibit confirms a demonstration, not customer shipments.1

Source record

  1. SK hynix: SK hynix HBM3E 48GB accessed 2026-11-11
  2. SK hynix CES 2025 exhibit accessed 2026-11-11

Every date is the publication date of the maker’s evidence. See who packages, bonds and tests SK hynix HBM on HBM Suppliers. Read the method or send a correction.

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